PCB Via Current Capacity Calculator
This tool helps prevent board failure caused by excessive heat in vertical interconnects. By calculating the internal surface area of the copper plating, we can estimate the resistance and the resulting temperature rise for a given current.
Use this tool to:
- Prevent Thermal Failure: Ensure your vias do not exceed the glass transition temperature (T_g) of your PCB substrate.
- Size Via Arrays: Determine how many parallel vias are required to carry high-current loads between layers.
- Optimize Plating: Evaluate how increasing plating thickness (e.g., from 0.5 oz to 1 oz) impacts current capacity.
Input Parameters
Calculated Results
Max Current (Total Amps)
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Via Resistance (mΩ)
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Voltage Drop (mV)
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Disclaimer: These results are theoretical estimates based on IPC-2221 typical values. Actual capacity may vary due to ambient temperature, PCB material tolerances, and nearby copper planes acting as heatsinks. Always verify requirements with physical testing.
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